Process for manufacturing a printed wiring board
US6775907B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2000 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Sep 25, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. Steps required to achieve this objective include adhering an electroless plated copper commoning layer to a surface roughened dielectric substrate. Subsequently, the commoning layer is photolithographically personalized by covering the commoning layer with a resist and then uncovering predetermined areas of the aforementioned commoning layer. Consequently, the semi-additive method involves electroplating copper onto the uncovered areas of the commoning layer, thereby generating copper features and circuitry. Finally, the semi-additive process requires the stripping of the remaining photoresist, and the unplated electroless copper layer is etched in order to electronically isolate the copper features and circuitry lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.