Patent · US Expired

Support for bending test of flexible substrates

US6776050B2 · kind B2 · utility

4Cited by

4References

30Claims

0Family size

Assignees

Osrano Opto Semiconductors GmbH · DE
Institute of Materials Research and Engineering · SG

Inventors

Mark Auch · Singapore, SG
Ewald Guenther · Regenstauf, DE
Chua Soo Jin · Singapore, SG
Chen Zhong · Xiamen, CN

Key dates

Filing date	Sep 28, 2001
Grant date	Aug 17, 2004
Priority date	—
Expiry date	Oct 30, 2021

Classification

Technology area (CPC G)Physics
CPC primaryG01N2203/0282
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A support for facilitating the bending test of flexible substrates is disclosed. The support includes a plastic or adhesive plastic applied on the substrate to keep the shards together after breakage, thereby eliminating the process of collecting the shards and fitting them back together for failure analysis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.