Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
US6776810B1 · kind B1 · utility
55Cited by
18References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1436
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged electrolyte.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.