Self-adhering thermal interface material
US6776923B2 · kind B2 · utility
9Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Feb 8, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a thermal interface composition which undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source to a heat sink, the composition comprising:(A) a viscoelastic composition which softens at about the operating temperature of the heat source, the viscoelastic composition comprising:(1) a thermoplastic elastomer,(2) a compatible hydrocarbon oil, and(3) a tackifying resin;(B) a dispersing agent; and(C) a thermally conductive filler dispersed within the viscoelastic composition.Also disclosed is a method for making the thermal interface composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.