Method of producing an etch-resistant polymer structure using electron beam lithography
US6777167B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Mar 20, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Sep 4, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2059
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a method of producing a structure of etch-resistant polymer on a substrate. A layer of sterol capable of polymerizing to form this structure is first deposited on a face of the substrate. Then, a first region of the layer of sterol is exposed to an electron beam to locally polymerize this layer and form the structure of etch-resistant polymer. A second region of the layer of sterol that has not been exposed to the electron beam is removed to leave on the face of the substrate only the structure of etch-resistant polymer. Finally, a region of the face of the substrate not covered by the structure of etch-resistant polymer can be etched away, and the structure of etch-resistant polymer removed following this etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.