Patent · US Expired

Dielectric element and manufacturing method therefor

US6777248B1 · kind B1 · utility

55Cited by
17References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 10, 2000
Grant dateAug 17, 2004
Priority date
Expiry dateMay 10, 2020

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/689
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A ferroelectric element having a high Pr and a low Ec and having a good withstand voltage, which is in the form of a thin film using a ferroelectric layer containing insulating particles, is provided. The ferroelectric layer containing the insulating particles is effective to suppress leakage current caused through grain boundaries of crystals, and hence to exhibit a high Pr and a low Ec and a good withstand voltage. The ferroelectric element has a structure in which such a ferroelectric layer in the form of a thin film is sandwiched between electrodes. By incorporating the ferroelectric element in a field effect transistor structure, it is possible to realize a highly integrated semiconductor device for detecting reading or writing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.