Planarizing method of semiconductor wafer and apparatus thereof
US6777337B2 · kind B2 · utility
4Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Mar 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a production process of a semiconductor device, planarizing of a wafer surface pattern can be performed to attain high planarity, good uniformity in the removal amount and improved controllability. This process include a step of planarizing a semiconductor wafer, from which at least two different films have been exposed, by polishing with a grindstone and a dispersant-containing processing liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.