Integrated circuit package substrate with multiple voltage supplies
US6777802B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate having multiple signal voltage power supplies is provided. The substrate may include a signal voltage power ring separated into segmented voltage supply connections laterally spaced across the upper surface of the substrate. In addition, the substrate may include a voltage supply plane formed within the substrate. The voltage supply plane may be separated into segmented planes. Vias may electrically connect the segmented voltage supply connections to the segmented planes. In an embodiment, at least 2 of the segmented planes may have different voltage supplies. For example, each of the segmented voltage supply connections are configurable to supply power to a portion of input/output drivers of an integrated circuit. Voltage supplies of the segmented planes may be determined based on voltage requirements of the portions of the input/output drivers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.