Die attach process using cornercube offset tool
US6778274B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2003 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jul 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/78301
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.