High-performance heat sink for printed circuit boards
US6778390B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | May 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method are described for cooling electronic components on a plug-in or other computer board placed within an enclosure. The inventive apparatus and system is capable of cooling a high power dissipating device, such as a Graphics Processing Unit and cooling individual ones of a plurality of other devices, such as memory chips, to within a specified temperature range. In one embodiment, cooling air is drawn from the edge of a plug-in card, over the GPU and is directed along and over arrays of memory chips. By directing the flow on and along the memory chips, a flow is established that maintains the chip-to-chip temperature difference to within a desired, uniform range. The invention allows for the incorporation of higher performance processors onto boards while maintaining memory chips within a temperature range that allows for predictable performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.