Reconfigurable multi-chip modules
US6779131B2 · kind B2 · utility
1Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Dec 31, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/4402
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method and apparatus for a reconfigurable multi-chip module. The reconfigurable multi-chip module includes a processor; a memory module connected to the processor; and a memory control component for controlling whether the processor uses the memory module. The method of producing multi-chip modules includes assembling a processor and a memory module on the multi-chip module; testing the memory module; and selectively configuring the processor to use the memory module based on the testing of the memory module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.