Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
US6779263B2 · kind B2 · utility
0Cited by
9References
8Claims
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Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Apr 30, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a system and apparatus by which a workpiece pad is supplied to support workpieces being implanted in a rotating or spinning batch implanter process disk. The workpiece pad provides reduced surface adhesion forces and sufficient heat transfer from the workpieces to the process disk, and furthermore reduces particle generation and contamination of the workpiece from the workpiece pad. The workpiece pad furthermore comprises an ordered array of micro-structures. In addition, the invention includes a method of forming a workpiece pad comprising an ordered array of micro-structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.