Method and structure for tape ball grid array package
US6779783B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Feb 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A tape ball grid array package and a method of fabricating the package. A dielectric tape having a metallic layer on both sides is provided. The metallic layers are patterned to form circuits. A plurality of via holes is formed in the dielectric tape. The via holes pass through the lower metallic layer and the tape dielectric but stop at the upper metallic layer, thereby forming a plurality of blind holes. A solder mask layer is formed over each side of the tape and the solder mask layers are patterned to expose a portion of the metallic layer serving as contact points for connecting with a chip. A solder ball is inserted into each blind hole. One end of the solder ball protrudes from the surface of the solder mask layer. Wire-bonding operation or flip-chip assembly process is conducted to form electrical connection between the chip and the contact points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.