Inventor · New Taipei, TW

Chen-Yueh Kung

22Patents
4h-index
8Co-inventors
52Inventor score

Filing activity: Feb 6, 2002 → Dec 17, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US7087991B2 Integrated circuit package and method of manufacture Emerging Cross-Sectional Technologies 51 Expired
US6977348B2 High density laminated substrate structure and manufacture method thereof Emerging Cross-Sectional Technologies 30 Expired
US6779783B2 Method and structure for tape ball grid array package Electricity 20 Expired
US10204852B2 Circuit substrate and semiconductor package structure Electricity 7 Active
US9497864B2 Circuit substrate, semiconductor package and process for fabricating the same Emerging Cross-Sectional Technologies 4 Active
US9786588B2 Circuit substrate and package structure Electricity 4 Active
US9066458B2 Fabricating method of circuit board and circuit board Emerging Cross-Sectional Technologies 2 Active
US10184956B2 Probe card Physics 1 Active
US8261436B2 Fabricating process of circuit substrate Emerging Cross-Sectional Technologies 1 Active
US10014246B2 Circuit substrate, semiconductor package and process for fabricating the same Emerging Cross-Sectional Technologies 1 Active
US8549745B2 Fabricating process of circuit substrate Emerging Cross-Sectional Technologies 1 Active
US9905519B1 Electronic structure process Electricity 1 Active
US9425066B2 Circuit substrate Electricity 1 Active
US9324580B2 Process for fabricating a circuit substrate Electricity 0 Active
US10002839B2 Electronic structure, and electronic structure array Electricity 0 Active
US9532467B2 Circuit substrate Emerging Cross-Sectional Technologies 0 Active
US10103115B2 Circuit substrate and semicondutor package structure Electricity 0 Active
US10119995B2 Probe card Physics 0 Active
US10573614B2 Process for fabricating a circuit substrate Electricity 0 Active
US10459007B2 Probe card Physics 0 Active
US8302298B2 Process for fabricating circuit substrate Emerging Cross-Sectional Technologies 0 Active
US9601425B2 Circuit substrate and semiconductor package structure Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.