Shield assembly for substrate processing chamber
US6780294B1 · kind B1 · utility
11Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Aug 19, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a shielding assembly for use within a substrate deposition processing chamber. The shielding assembly permits sputtering and evaporation processes to take place without the target material depositing upon the internal non-disposable surfaces of the chamber. The shielding assembly is of an improved construction which permits it to be uncoupled from an adapter plate without the need for removing the adapter plate from the deposition chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.