Method for multi-frequency bonding
US6780759B2 · kind B2 · utility
51Cited by
7References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2001 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Oct 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and technique for achieving a high strength bond between two substrates includes igniting a plasma using a source RF signal. The substrates are biased with a bias RF signal during surface treatment by the plasma. The treated surfaces are brought into contact. The resulting bonded substrates show an improvement over bonds attained using conventional bonding techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.