Adhesive resin composition and method for separating adherends bonded together by the composition
US6780940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Jun 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1153
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.