Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
US6781064B1 · kind B1 · utility
12Cited by
37References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1999 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Jun 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09881
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package. This printed circuit board includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.