Circuit singulation system and method
US6781093B2 · kind B2 · utility
37Cited by
4References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Dec 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.