Semiconductor device and package including forming pyramid mount protruding through silicon substrate
US6781224B2 · kind B2 · utility
26Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.