Donut power mesh scheme for flip chip package

US6781228B2 · kind B2 · utility

Assignee

• LSI Logic Corporation · US

Inventors

• Hiroshi Ishikawa · Tsukuba, JP
• Thomas Antisseril · Newark, US
• Radoslav Ratchkov · Santa Clara, US
• Bo Shen · Fremont, US
• Prasad Subbarao · San Jose, US
• Maad Al-Dabagh · San Jose, US
• Anwar Ali · San Jose, US
• Benjamin Mbouombouo · San Jose, US

Key dates

• Filing date: Jan 10, 2003
• Grant date: Aug 24, 2004
• Expiry date: Jan 10, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/81801
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multiple layer mesh design which includes a layer which provides a vertical mesh and an adjacent layer which provides a horizontal mesh which includes an open area or hole. The layer which provides the horizontal mesh (with hole) may either be above or below the vertical mesh layer, depending on the design. The vertical mesh may be full or may surround an open area or hole where the design includes both a horizontal donut mesh and a vertical donut mesh.