Method of assembling a multi-chip device
US6782611B2 · kind B2 · utility
1Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1999 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Sep 17, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are then tested, and the interposer is coupled to a substrate with the solder balls for further assembly only if the test is passed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.