Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
US6782843B2 · kind B2 · utility
47Cited by
17References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Apr 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32522
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma processing system is provided, having processor integral cooling passages for reducing an operating temperature thereof during processing of a wafer by the system. Cooling medium inlets and outlets are connected to the cooling passages to permit circulation of a cooling medium through the cooling passages. The baffle plate comprises a generally planar, apertured, gas distribution central portion surrounded by a flange into both of which the cooling passages may extend. Further, the baffle plate may have a non-apertured plate overlying and covering apertures in a central portion of the baffle plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.