Apparatus for connecting semiconductor modules
US6783372B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides an apparatus for connecting semiconductor modules, in particular memory banks, having: at least two devices (A, B) for receiving a respective semiconductor module (1, 2); a contact device (13a, 13b, 13c, 13d, 13e, 13f) having a first group of contacts (13a, 13b, 13c, 13d) and a second group of contacts (13e, 13f), the two groups being able to be connected to one another by means of a variable connection module (3, 4); a group of lines (10, 11, 20, 21) for connecting the receiving devices (A, B) to the first group of contacts (13a, 13b, 13c, 13d), a subgroup (13b, 13c) of the first group of contacts being assigned to the lines (10, 11) of the first receiving device (A); the connection module (3, 4) connecting either a subgroup of the contacts (13b, 13c) to the second group of contacts (13e, 13f), or the first group of contacts (13a, 13b, 13c, 13d) to the second group of contacts (13e, 13f). The present invention likewise provides a method for connecting semiconductor modules, in particular memory banks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.