Patent · US Expired

Wafer handling device

US6783596B2 · kind B2 · utility

1Cited by

10References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andre Schaefer · Hersbruck, DE
Andrea Zuckerstaetter · Hersbruck, DE

Key dates

Filing date	Aug 20, 2002
Grant date	Aug 31, 2004
Priority date	—
Expiry date	Aug 20, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S414/141
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention provides a wafer handling device having a base plate (G; G′), which has a first and a second supporting surface for a respective wafer (W1, W2) to be laid on; and a fixing device (K1, K2, S; K1′, K2′, S′) for the detachable fixing of the respective wafer (W1, W2) on the first and second supporting surface; the fixing device (K1, K2, S; K1′, K2′, S′) being configured in such a way that it contacts the respective wafer (W1, W2) only in the outer edge region of the side facing away from the supporting surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.