Process of fabricating a precision microcontact printing stamp
US6783717B2 · kind B2 · utility
14Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Aug 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process of making a high precision microcontact printing stamp in which an elastomeric monomer or oligomer is introduced into a mold wherein a photoresist master imprinted with a microcircuit design in negative relief is predisposed. The monomer or oligomer is cured at a temperature no higher than about ambient temperature whereby a distortion-free microcontact printing stamp having the microcircuit design of the photoresist master in positive relief is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.