Method for etching laminated assembly including polyimide layer
US6783921B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Feb 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an etching method of a laminated assembly having a metal layer and a non-thermoplastic polyimide layer bonded together via thermoplastic polyimide, which comprises using an etchant at least containing an alkali metal hydroxide, water and oxyalkylamine, wherein the concentrations of the alkali metal hydroxide (X weight %) and of the water (Y weight %) have relationships represented by coordinate points present within a region (inclusive of boundary lines) defined by the following expressions [1] and [2]:Y=(½)X (provided that 7≦X≦45)  [1]Y=({fraction (5/20)})X+17.5 (provided that 7≦X≦45)  [2]provided that X and Y are defined based on the total weight of the alkali metal hydroxide, water and oxyalkylamine expressed as 100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.