Copper surface passivation during semiconductor manufacturing
US6784093B1 · kind B1 · utility
6Cited by
4References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Jun 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/958
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the invention is a method to reduce the corrosion of copper interconnects 90 by forming a thiol ligand coating 130 on the surface of the copper interconnects 90.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.