Changfeng Xia
20Patents
4h-index
26Co-inventors
63Inventor score
Filing activity: Apr 29, 1998 → Jul 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6743719B1 | Method for forming a conductive copper structure | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6053123A | Plasma-assisted metallic film deposition | Electricity | 7 | Expired |
| US6784093B1 | Copper surface passivation during semiconductor manufacturing | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7267726B2 | Method and apparatus for removing polymer residue from semiconductor wafer edge and back side | Electricity | 5 | Expired |
| US7144802B2 | Vapor deposition of benzotriazole (BTA) for protecting copper interconnects | Electricity | 4 | Expired |
| US6015464A | Film growth system and method for spherical-shaped semiconductor integrated circuits | Electricity | 3 | Expired |
| US7067015B2 | Modified clean chemistry and megasonic nozzle for removing backside CMP slurries | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6221165A | High temperature plasma-assisted diffusion | Electricity | 3 | Expired |
| US7550046B2 | Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnects | Electricity | 3 | Active |
| US7195679B2 | Versatile system for wafer edge remediation | Emerging Cross-Sectional Technologies | 2 | Expired |
| US10077188B2 | Manufacturing method of MEMS chip | Performing Operations; Transporting | 1 | Active |
| US7198705B2 | Plating-rinse-plating process for fabricating copper interconnects | Electricity | 1 | Expired |
| US9006867B2 | Monitoring structure and monitoring method for silicon wet etching depth | Electricity | 0 | Active |
| US9903884B2 | Parallel plate capacitor and acceleration sensor comprising same | Physics | 0 | Active |
| US11671765B2 | Micro-Electro-Mechanical System device | Electricity | 0 | Active |
| US12215963B2 | Galvanometer positioning tool and laser printer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9580301B2 | MEMS chip and manufacturing method therefor | Performing Operations; Transporting | 0 | Active |
| US11402952B2 | Method and circuit for obtaining capacitive feedback signal of capacitive feedback-type micro torsion mirror | Performing Operations; Transporting | 0 | Active |
| US6303517A | Fast deposition on spherical-shaped integrated circuits in non-contact CVD process | Chemistry; Metallurgy | 0 | Expired |
| US12022270B2 | MEMS microphone and preparation method therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.