Method for pretreating a substrate prior to application of a polymeric coat
US6784120B2 · kind B2 · utility
6Cited by
10References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Oct 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.