Symmetric stack up structure for organic BGA chip carriers
US6784536B1 · kind B1 · utility
7Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved structure for an organic ball-grid array chip carrier having an organic substrate attached to a metal heat sink plate to prevent the chip carrier from warping. A supplemental organic substrate is attached to the metal heat sink plate on the side opposite from the functional organic substrate to provide symmetry to the bending forces resulting from the mismatch in coefficients of thermal expansion between the organic substrate and the metal heat sink plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.