Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package

US6785458B2 · kind B2 · utility

Assignee

• Georgia Tech Research Corporation · US

Inventors

• Tony Mule · Hillsboro, US
• Chirag S. Patel · Peekskill, US
• James D. Meindl · Atlanta, US
• Thomas K. Gaylord · Atlanta, US
• Elias N. Glytsis · Dunwoody, US
• Kevin P. Martin · Atlanta, US
• Stephen M. Schultz · Tucson, US
• Muhannad Bakir · Atlanta, US
• Hollie Reed · Smyrna, US
• Paul A. Kohl · Chatham, US

Key dates

• Filing date: Feb 11, 2002
• Grant date: Aug 31, 2004
• Expiry date: Feb 11, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12107
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.