Inventor · Peekskill, NY, US

Chirag S. Patel

47Patents
15h-index
65Co-inventors
80Inventor score

Filing activity: Oct 26, 2000 → Aug 8, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US7276787B2 Silicon chip carrier with conductive through-vias and method for fabricating same Electricity 90 Expired
US7033927B2 Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer Electricity 60 Expired
USD671049S1 Vehicle bumper unit General 50 Active
US7488680B2 Conductive through via process for electronic device carriers Emerging Cross-Sectional Technologies 47 Active
US7230334B2 Semiconductor integrated circuit chip packages having integrated microchannel cooling modules Electricity 41 Expired
US6528349B1 Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability Electricity 34 Expired
USD671454S1 Vehicle exterior General 30 Active
US7352066B2 Silicon based optical vias Electricity 29 Expired
US6690081B2 Compliant wafer-level packaging devices and methods of fabrication Electricity 28 Expired
USD671051S1 Vehicle bumper garnish General 22 Active
US7518229B2 Versatile Si-based packaging with integrated passive components for mmWave applications Electricity 21 Active
US7808798B2 Versatile Si-based packaging with integrated passive components for mmWave applications Electricity 21 Active
USD592585S1 Vehicle ceiling console General 21 Expired
US8439435B2 Passenger seat Emerging Cross-Sectional Technologies 20 Active
US8733840B2 Seat pan assembly Performing Operations; Transporting 19 Active
USD671050S1 Vehicle bumper garnish General 15 Active
US8405226B2 Semiconductor device and method of making semiconductor device Electricity 14 Active
US8290008B2 Silicon carrier optoelectronic packaging Electricity 14 Active
USD619069S1 Wheel General 14 Expired
USD619525S1 Wheel General 12 Expired
US6972243B2 Fabrication of semiconductor dies with micro-pins and structures produced therewith Electricity 12 Expired
US8755644B2 Silicon based optical vias Electricity 12 Active
US6785458B2 Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Physics 12 Expired
US7189595B2 Method of manufacture of silicon based package and devices manufactured thereby Electricity 10 Expired
US7518225B2 Chip system architecture for performance enhancement, power reduction and cost reduction Electricity 9 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.