Method and system for sensing IC package orientation in sockets
US6786760B1 · kind B1 · utility
2Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2003 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Apr 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.