Adhesively bonded chip-and wafer stacks

US6787244B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Recai Sezi · Simmerath, DE
• Andreas Walter · Egloffstein, DE

Key dates

• Filing date: Jul 30, 2002
• Grant date: Sep 7, 2004
• Expiry date: Aug 22, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31725
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).