Method of detecting spatially correlated variations in a parameter of an integrated circuit die
US6787379B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2001 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Feb 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of detecting spatially correlated variations that may be used for detecting statistical outliers in a production lot of integrated circuits to increase the average service life of the production lot includes measuring a selected parameter of each of a plurality of electronic circuits replicated on a common surface; calculating a difference between a value of the selected parameter at a target location and a value of the selected parameter an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.