Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication
US6787397B2 · kind B2 · utility
6Cited by
4References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 29, 2003 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Apr 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device with a low stress, thin film, protective overcoat having enhanced adhesion both to polymeric materials used in packaging-semiconductor devices, and within the passivating film layers, including the following sequence of materials deposited by PECVD processing: a thin film of silicon dioxide, a layer of silicon nitride, oxy-nitride or silicon carbide, and a very thin topmost layer of silicon oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.