PCB design and method for providing vented blind vias
US6787443B1 · kind B1 · utility
120Cited by
17References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2003 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | May 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for providing a vented blind via in pad of a printed circuit board (PCB). A vent in the blind via in pad to allow gases formed during reflow soldering to escape from the solder joint. In one embodiment, the vent extends from the outer edge of the pad to the blind via. In another embodiment, a method includes forming a blind via in pad having a vent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.