Semiconductor integrated circuit device
US6787904B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Nov 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A main circuit block and a sub-circuit block are located alongside of each other on a substrate of a semiconductor integrated circuit device. A plurality of bonding pads, which are connected to external leads of the device, are disposed around the main circuit block. A plurality of first wires are disposed extending from the main circuit block into space between the bonding pads. Each wire has a shape connectable to another wire, for example the wire has a tip having a portion perpendicular to the semiconductor substrate, or the wire has a tip having a cross-wire portion which intersect with an extended line of the wire. A plurality of second wires are extended from the sub-circuit block, and each electrically connected to one of the first wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.