Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
US6787916B2 · kind B2 · utility
130Cited by
155References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2001 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Sep 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor dies are bonded to contact pads formed in a substrate's cavity. Vias through the substrate open into the cavity. Conductive lines passing through the vias connect the contact pads in the cavity to contact pads on another side of the substrate. A passage in the substrate opens into the cavity and provides an escape or pressure relief path for material filling the cavity. The passage can also be used to introduce material into the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.