Patrick B. Halahan
17Patents
13h-index
9Co-inventors
71Inventor score
Filing activity: Mar 30, 1994 → Jan 4, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7049170B2 | Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities | Electricity | 352 | Expired |
| US7060601B2 | Packaging substrates for integrated circuits and soldering methods | Electricity | 326 | Expired |
| US6498381B2 | Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same | Emerging Cross-Sectional Technologies | 137 | Expired |
| US6787916B2 | Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity | Electricity | 130 | Expired |
| US7034401B2 | Packaging substrates for integrated circuits and soldering methods | Electricity | 83 | Expired |
| US6753205B2 | Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity | Electricity | 64 | Expired |
| US6498074B2 | Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6844241B2 | Fabrication of semiconductor structures having multiple conductive layers in an opening | Emerging Cross-Sectional Technologies | 49 | Expired |
| US7186586B2 | Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities | Electricity | 49 | Expired |
| US7001825B2 | Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same | Emerging Cross-Sectional Technologies | 39 | Expired |
| US8948921B2 | System and method for smart irrigation | Physics | 35 | Active |
| US9414552B2 | System and method for smart irrigation | Physics | 25 | Active |
| US6448153B2 | Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | Electricity | 17 | Expired |
| US9986696B2 | Irrigation smart controllers with programming and firmware updating | Physics | 10 | Active |
| US6121571A | Plasma generator ignition circuit | Electricity | 4 | Expired |
| US5442673A | Fixed septum collimator for electron beam tomography | Human Necessities | 3 | Expired |
| US10779484B2 | Irrigation smart controllers with programming and firmware updating | Physics | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.