Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies
US6788093B2 · kind B2 · utility
113Cited by
16References
17Claims
0Family size
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Key dates
| Filing date | Aug 7, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Oct 13, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and structure tests devices on a wafer by applying an electrical bias to the devices and simultaneously monitoring emitted light from all of the devices. The emitted light indicates locations of defective devices and records time-based images of the emitted light across the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.