Inventor · Williston, VT, US

Fen Chen

72Patents
9h-index
61Co-inventors
81Inventor score

Filing activity: Sep 20, 2000 → Oct 17, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US6788093B2 Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies Physics 113 Expired
US8053814B2 On-chip embedded thermal antenna for chip cooling Electricity 45 Active
US8847401B2 Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure Electricity 17 Active
US7381981B2 Phase-change TaN resistor based triple-state/multi-state read only memory Electricity 16 Expired
US8563336B2 Method for forming thin film resistor and terminal bond pad simultaneously Electricity 15 Active
US6639242B1 Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits Emerging Cross-Sectional Technologies 15 Expired
US7571637B2 Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip Physics 13 Active
US8405135B2 3D via capacitor with a floating conductive plate for improved reliability Electricity 11 Active
US7345503B2 Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices Electricity 10 Active
US7084483B2 Trench type buried on-chip precision programmable resistor Electricity 9 Expired
US6790744B2 Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits Emerging Cross-Sectional Technologies 9 Expired
US10126260B2 Moisture detection and ingression monitoring systems and methods of manufacture Electricity 5 Active
US8362794B2 Method and system for assessing reliability of integrated circuit Physics 4 Active
US9812359B2 Thru-silicon-via structures Electricity 4 Active
US10309919B2 Moisture detection and ingression monitoring systems and methods of manufacture Electricity 4 Active
US9891261B2 Electromigration monitor Electricity 4 Active
US7768815B2 Optoelectronic memory devices Physics 4 Active
US8779491B2 3D via capacitor with a floating conductive plate for improved reliability Electricity 4 Active
US9093503B1 Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure Electricity 4 Active
US8569888B2 Wiring structure and method of forming the structure Electricity 3 Active
US7795679B2 Device structures with a self-aligned damage layer and methods for forming such device structures Electricity 3 Active
US8890556B2 Real-time on-chip EM performance monitoring Physics 3 Active
US9159671B2 Copper wire and dielectric with air gaps Electricity 3 Active
US7709401B2 Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Emerging Cross-Sectional Technologies 3 Active
US8609504B2 3D via capacitor with a floating conductive plate for improved reliability Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.