Patent · US Expired

Method and arrangement for transporting and inspecting semiconductor substrates

US6789436B2 · kind B2 · utility

0Cited by

10References

6Claims

0Family size

Assignee

Leica Microsystems Jena GmbH · DE

Inventors

Andreas Birkner · Jena, DE
Frank Bernhardt · Eppelheim, DE
Knut Hiltawski · Saalfeld, DE

Key dates

Filing date	Mar 6, 2003
Grant date	Sep 14, 2004
Priority date	—
Expiry date	Apr 1, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67748
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.