Method for processing a work piece in a multi-zonal processing apparatus
US6790123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Mar 21, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Layers of material deposited exhibit both a local and a global pattern. The local pattern is a function of the underlying wafer surface, but the global pattern is a function of the equipment in which the layer was deposited. Accurate reconstruction of the surface topology of a layer on a product wafer is achieved despite the local pattern by determining the surface topology of a blanket layer on a blank wafer, measuring the thickness of the layer at a few selected locations on a product wafer, calculating scaling coefficients representing deviations of the measured thickness from the blanket layer topology, and then multiplying the blanket layer topology by the scaling coefficients. The surface reconstruction results from modifying the surface topology of the blanket layer so that it has the same thickness at the measured locations as does the product wafer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.