Method for polishing angular substrates
US6790129B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Aug 8, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An angular substrate polishing method includes the steps of holding an angular substrate having a surface to be polished within a guide ring of a substrate holding head; pressing the substrate surface to be polished, and also one surface of the guide ring, against a polishing pad; and independently rotating the polishing pad and the substrate-holding head together with the substrate it holds while pressing the polishing pad-contacting surface of the guide ring against the polishing pad, to thereby polish the substrate surface. During the polishing step, a pressing force is applied to the guide ring which is separate from the pressing force applied to the substrate, enhancing the flatness of the polished substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.