Method for capacitively coupling electronic devices
US6790704B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2001 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Jul 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for electrically coupling a first set of electrically conductive pads on a first semiconductor substrate to a second set of electrically conductive pads on a second semiconductor substrate is described. Dielectric material of a first thickness is deposited on at least one set of the first and second sets of electrically conductive pads. The first and second semiconductor substrates are then attached together such that such that the first and second sets of pads are substantially aligned parallel to one another and such that the dielectric material is disposed between the first and second sets of electrically conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.