Brian S. Doyle
378Patents
54h-index
156Co-inventors
93Inventor score
Filing activity: Mar 4, 1993 → Apr 14, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6858478B2 | Tri-gate devices and methods of fabrication | Emerging Cross-Sectional Technologies | 426 | Expired |
| US7326656B2 | Method of forming a metal oxide dielectric | Emerging Cross-Sectional Technologies | 424 | Expired |
| US7105390B2 | Nonplanar transistors with metal gate electrodes | Electricity | 366 | Expired |
| US6423614B1 | Method of delaminating a thin film using non-thermal techniques | Electricity | 359 | Expired |
| US7662689B2 | Strained transistor integration for CMOS | Electricity | 321 | Expired |
| US6063688A | Fabrication of deep submicron structures and quantum wire transistors using hard-mask transistor width definition | Emerging Cross-Sectional Technologies | 297 | Expired |
| US6281532A | Technique to obtain increased channel mobilities in NMOS transistors by gate electrode engineering | Electricity | 250 | Expired |
| US6054370A | Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer | Emerging Cross-Sectional Technologies | 246 | Expired |
| US6605498B1 | Semiconductor transistor having a backfilled channel material | Electricity | 231 | Expired |
| US6228694A | Method of increasing the mobility of MOS transistors by use of localized stress regions | Electricity | 230 | Expired |
| US7563701B2 | Self-aligned contacts for transistors | Electricity | 229 | Expired |
| US6909151B2 | Nonplanar device with stress incorporation layer and method of fabrication | Electricity | 187 | Expired |
| US6790704B2 | Method for capacitively coupling electronic devices | Electricity | 180 | Expired |
| US7456476B2 | Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication | Electricity | 173 | Expired |
| US7531437B2 | Method of forming metal gate electrodes using sacrificial gate electrode material and sacrificial gate dielectric material | Emerging Cross-Sectional Technologies | 172 | Expired |
| US6362082B1 | Methodology for control of short channel effects in MOS transistors | Electricity | 164 | Expired |
| US7825437B2 | Unity beta ratio tri-gate transistor static random access memory (SRAM) | Electricity | 162 | Active |
| US7485536B2 | Abrupt junction formation by atomic layer epitaxy of in situ delta doped dopant diffusion barriers | Electricity | 144 | Expired |
| US7268058B2 | Tri-gate transistors and methods to fabricate same | Electricity | 144 | Expired |
| US7183597B2 | Quantum wire gate device and method of making same | Emerging Cross-Sectional Technologies | 141 | Expired |
| US7170120B2 | Carbon nanotube energy well (CNEW) field effect transistor | Emerging Cross-Sectional Technologies | 136 | Expired |
| US5596218A | Hot carrier-hard gate oxides by nitrogen implantation before gate oxidation | Electricity | 125 | Expired |
| US7037790B2 | Independently accessed double-gate and tri-gate transistors in same process flow | Electricity | 120 | Expired |
| US7531393B2 | Non-planar MOS structure with a strained channel region | Electricity | 119 | Active |
| US7358121B2 | Tri-gate devices and methods of fabrication | Emerging Cross-Sectional Technologies | 117 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.