Interposer to couple a microelectronic device package to a circuit board
US6791035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Apr 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside with copper. The copper surface coating is etched to form multiple traces. In one embodiment, the substrate is cut through each row of via holes and between each row of via holes to produce multiple individual beam-and-trace interposers. Two or more such interposers may be affixed together to form a beam-and-trace interposer array. Alternatively, the substrate is not cut into strips, and each via hole is filled completely with a conductive material to form an array of solid conductive columns through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.