Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
US6791178B2 · kind B2 · utility
48Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Mar 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1581
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module has semiconductor devices and a wiring substrate for mounting the semiconductor devices, in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.